Identification of crack propagation of a lead-free solder material using dic and fem methods
Abstract
For electronic devices, solder joint is a weakness that easily leads to failure during working. Therefore, the diagnosis of failure of the joint, especially determining the path of a crack, is very important. The development of modern analytical measurement techniques is very necessary and has received much attention from scientists around the world.One of the newly methods to solve the problem is Digital Image Correlation (DIC) and FEM as well.Thus, in this study, the digital image correlation and FEM methods will be used to determine the crack propagation of InnoLot lead-free material. The results of the study are important in predicting the failure of materials in order to prevent failure.
Moraref